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Advanced package & silicon co-design process achieves optimum solution at a lower cost

Assembly
Comprehensive assembly services for discrete, wirebond and flip chip packages to advanced wafer level packaging (WLP), Package-on-Package (PoP) and System-in-Package (SiP) solutions
Advanced substrates, enhanced molding processes, high density SMT, and electromagnetic interference (EMI) shielding for SiP solutions
Significant manufacturing scale in China, South Korea and Singapore
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