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  • Wafer Level

  • SiP

  • Flip Chip

  • Laminate

  • Leaded

  • Discrete

Fan-in (Wafer Level Package)

  • WLCSP

  • eWLCSP

Fan-out (Wafer Level Package)-威尼斯人娱乐城真钱赌博

  • eWLB 300mm / HD 330mm (2D, 2.5D, 3D）

Integrated Passive Devices

  • IPD

Through Silicon Via

  • TSV for CIS

  • TSV for rocessor (in development)

System-in-Package

  • FOWLP SiP

  • Laminate FC SiP

  • Laminate FC + WB SiP

  • SiP Modules

  • Leadframe WB SiP

  • Laminate Stack Die WB SiP

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Flip Chip Packages

  • fcFBGA

  • fcBGA

  • fcCuBE

  • Bare die fcPoP

  • Molded Laser fcPoP

  • Flip Chip on Leadframe (FCOL)

  • Molded Interconnect System (MIS)

Substrate Packages

  • PBGA

  • FBGA (Stacked Die)

  • Package-on-Package

  • MEMS

  • LGA

  • Smart Card

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Lead Frame Packages

  • QFN

  • DFN

  • QFP

  • SOT

  • SOP

  • DIP

  • Molded Interconnect System (MIS)

Discrete Packages

  • TO

  • SOD

  • SOT

  • FBP

  • DFN

  • SOP

Discrete Products

  • Diodes

  • MOSFET

  • Transistors

  • Rectifier

  • BRT

  • TRIACS

  • TVS

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